Huawei’s AI Chips: A Deep Dive into the Ascend 910, 910B, and 610
In the ever-evolving world of artificial intelligence (AI), Huawei has been making waves with its HiSilicon Ascend series of AI chips. Recently, die shots of the HiSilicon Ascend 910, Ascend 910B, and an enigmatic Ascend 610 have surfaced, shedding light on the technological advancements and differences between these chips. These images, shared by Kurnalsalts, reveal fascinating details about Huawei’s AI hardware, including the manufacturing processes and architectural designs behind these chips.
The Ascend 910: A TSMC-Produced Powerhouse
The HiSilicon Ascend 910, produced by Taiwan Semiconductor Manufacturing Company (TSMC), is a marvel of engineering. This AI chip employs a multi-chiplet architecture, featuring a Virtuvian AI processor, a Nimbus V3 I/O die, four HBM2E memory stacks, and two dummy dies for uniformity. The compute chiplet, known as the Virtuvian, is the heart of the Ascend 910 and boasts impressive specifications.
- 32 DaVinci Max AI cores arranged in four clusters
- Support for INT8 and FP16 formats
- A 1024-bit mesh network-on-chip operating at 2 GHz
- Bandwidth of up to 128 GB/s per core
- Four 1024-bit HBM2 interfaces
- Five die-to-die interfaces for connectivity
The Virtuvian chiplet was fabricated using TSMC’s N7+ process, which incorporates a few extreme ultraviolet (EUV) layers. Measuring 14.6 mm × 31.25 mm, the die size comes to 456.25 mm². This compact yet powerful design underscores TSMC’s expertise in high-density semiconductor manufacturing.
The Ascend 910B: A SMIC-Produced Contender
In contrast to the Ascend 910, the Ascend 910B is believed to be manufactured by China’s Semiconductor Manufacturing International Corporation (SMIC) using its N+1 fabrication technology. This process is considered a 7nm-class production node, but the differences between the two chips are striking.
The compute chiplet of the Ascend 910B, referred to as Virtuvian B, measures 21.32 mm × 31.22 mm, resulting in a significantly larger die size of 665.61 mm². Unlike the original Ascend 910, the 910B features 25 DaVinci AI cores, which are speculated to be “New DaVinci” cores rather than the DaVinci Max cores found in the 910. While the exact improvements of these new cores remain unclear, it is likely that they are backward compatible with the original DaVinci Max cores.
The larger die size of the Virtuvian B raises questions about SMIC’s N+1 process. It suggests that SMIC’s technology may have a lower transistor density compared to TSMC’s N7+ process. Alternatively, HiSilicon might have enhanced the DaVinci cores, potentially sacrificing core count for performance improvements, though this scenario seems less likely.
The Mystery of the Ascend 610
Adding to the intrigue is the Ascend 610, an AI chip that has yet to be officially acknowledged by Huawei. According to the die shots shared by Kurnalsalts, this chip includes:
- 16 general-purpose CPU cores
- Eight DaVinci Max cores
- “DaVinci mini” cores
- A 192-bit LPDDR5 memory interface
The market positioning of the Ascend 610 remains uncertain, but it could be designed for edge devices requiring robust CPU performance and advanced AI capabilities. Speculation suggests that SMIC may also be responsible for manufacturing this chip, further highlighting China’s push for self-reliance in semiconductor technology.
What These Chips Mean for Huawei and AI
The differences between the Ascend 910 and 910B highlight the challenges and opportunities in semiconductor manufacturing. While TSMC’s N7+ process enables high-density, compact designs, SMIC’s N+1 process appears to prioritize other factors, potentially at the expense of transistor density. This divergence underscores the technological gap between the two foundries, but it also showcases Huawei’s adaptability in leveraging different manufacturing processes to achieve its goals.
Moreover, the emergence of the Ascend 610 hints at Huawei’s ambitions to expand its AI hardware portfolio. By targeting edge devices, Huawei could tap into a growing market for AI-powered applications in industries such as healthcare, automotive, and IoT.
Key Takeaways
- The HiSilicon Ascend 910, produced by TSMC, features 32 DaVinci Max AI cores and a compact design enabled by the N7+ process.
- The Ascend 910B, manufactured by SMIC, has 25 “New DaVinci” AI cores and a larger die size, reflecting differences in fabrication technology.
- The Ascend 610, an unconfirmed AI chip, combines CPU and AI cores, potentially targeting edge devices.
- These developments highlight Huawei’s efforts to innovate in AI hardware despite geopolitical and technological challenges.
As Huawei continues to push the boundaries of AI chip design, the competition between TSMC and SMIC will play a crucial role in shaping the future of semiconductor technology. Whether it’s the high-density designs of TSMC or the emerging capabilities of SMIC, one thing is clear: the race for AI supremacy is far from over.
Originally Written by: Anton Shilov
